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APDA Technology
Design your solution
A) Substrate Design Feasibility
B) Package Electrical Feasibility
C) Package Thermal Feasibility
D) Package Mechanical Feasibiltiy
E) Packaging Turnkey Solution
B) Package Electrical Feasibility
  • Full / distributed package RLC extraction modeling and high speed S-parameter analysis
 
Output Parameters
  • Parasitic Extraction – Self / Mutual Inductance & Capacitance
  • S-Parameter Matrix and Graphic
  • Impedance Calculation (Single End, Differential Mode)
  • Equivalent Circuit on HSPICE
  • Power and Ground Nets Analysis


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