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Design your solution
A) Substrate Design Feasibility
B) Package Electrical Feasibility
C) Package Thermal Feasibility
D) Package Mechanical Feasibiltiy
E) Packaging Turnkey Solution
B) Package Electrical Feasibility
Full / distributed package RLC extraction modeling and high speed S-parameter analysis
Output Parameters
Parasitic Extraction – Self / Mutual Inductance & Capacitance
S-Parameter Matrix and Graphic
Impedance Calculation (Single End, Differential Mode)
Equivalent Circuit on HSPICE
Power and Ground Nets Analysis
Flash Intro
|
Home
|
Our Mission
|
Scope of Services
|
Reference & Partnership
|
Feedback
|
Contact Us
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