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APDA Technology
Design your solution
A) Substrate Design Feasibility
B) Package Electrical Feasibility
C) Package Thermal Feasibility
D) Package Mechanical Feasibiltiy
E) Packaging Turnkey Solution
C) Package Thermal Feasibility
  • Junction-to-ambient, junction-to-board, junction-to-case package thermal resistance at JEDEC and customer specified conditions
     
Output Parameters
  • theta ja in Still and Moving Air Conditions
  • theta jb , theta jc in JEDEC Standard Conditions
  • Customer Conditions including package, board and up to system level & additional features (heatsink, fan & vent)
  

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