APDA Technology - Scope of Services

Scope of Services

	APDA Technology
	Design your solution

A) Substrate Design Feasibility

B) Package Electrical Feasibility

C) Package Thermal Feasibility

D) Package Mechanical Feasibiltiy

E) Packaging Turnkey Solution

Scope of Services

Expertise – 专业

Consultants from IC packaging industry with more than 12 years experience on individual areas including Substrate Design (基板设计), Package Electrical Characterization (封装电 / 热性能分析) and Technical Advisory (技术咨询服务)

Reference & Partnership

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